Advanced Interconnects for ULSI Technology
M Baklanov
ISBN 10: 0470662549 ISBN 13: 9780470662540
Published by John Wiley & Sons, 2012
New
Hardcover
From
moluna, Greven, Germany
Seller rating 5 out of 5 stars
AbeBooks Seller since July 9, 2020
This specific item is no longer available.
About this Item
Description:
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over. Seller Inventory # 556557172
Synopsis:
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance.
Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses:
- Interconnect functions, characterisations, electrical properties and wiring requirements
- Low-k materials: fundamentals, advances and mechanical properties
- Conductive layers and barriers
- Integration and reliability including mechanical reliability, electromigration and electrical breakdown
- New approaches including 3D, optical, wireless interchip, and carbon-based interconnects
Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
About the Author:
Mikhail R. Baklanov
IMEC, Leuven, Belgium
Paul S. Ho
Laboratory for Interconnect and Packaging, University of Texas at Austin, Austin, Texas, USA
Ehrenfried Zschech
Fraunhofer Institute for Nondestructive Testing, Dresden, Germany
"About this title" may belong to another edition of this title.
Bibliographic Details
Title: Advanced Interconnects for ULSI Technology
Publisher: John Wiley & Sons
Publication Date: 2012
Binding: Hardcover
Condition: New