Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering : Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method

Language: English

Published by Springer International Publishing, Springer International Publishing, 2019

3030085619 / 9783030085612

Series: Book 50 of 74 - Springer Series in Advanced Manufacturing

  • Softcover
  • New
See all details

Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

5-star seller

AbeBooks seller since August 14, 2006

View this seller's items
Softcover

Condition: New

US$ 179.82

US$ 71.11 shipping 
Ships from Germany to U.S.A.

Quantity: 1 available

Add to basket

Item description from seller

Druck auf Anfrage Neuware - Printed after ordering - This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.

Seller Inventory # 9783030085612

Title
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering : Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Author
Seonho Seok
Publisher
Springer International Publishing, Springer International Publishing
Publication year
2019
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
3030085619
ISBN 13
9783030085612
Item weight
201 grams
Dimensions
235x155x8 mm
Series
Book 50 of 74: Springer Series in Advanced Manufacturing

AHA-BUCH GmbH

Einbeck, Germany

5-star seller

AbeBooks seller since August 14, 2006

Shipping rates from Germany to U.S.A.

Item30 to 40 business days7 to 14 business days
First itemUS$ 71.11US$ 82.77
Delivery times are set by sellers and vary by carrier and location. Orders passing through Customs may face delays and buyers are responsible for any associated duties or fees. Sellers may contact you regarding additional charges to cover any increased costs to ship your items.

Payment methods

VisaMastercardAmerican ExpressApple PayGoogle Pay
Bank Wire Transfer
Check
Paypal

Store description

Das Unternehmen AHA-BUCH GmbH: Seit der Gründung von AHA-BUCH im Juli 2005 ist unser Hauptziel, zufriedenen Kunden so schnell und so preisgünstig wie möglich ihren Bücherwunsch zu erfüllen. Unsere Firma beschäftigt 16 Mitarbeiter, die nur ein Ziel kennen: den Kunden und seine Wünsche! Auf über 3700 m2 Fläche haben wir über 100.000 Bücher, Modernes Antiquariat und Spiele auf Lager.

Specialty

Kinderbücher & Kinderhör Casetten, German Books, Software, Natur & Tiere, Ratgeber, Sachbücher, Englische Bücher, Medizin & Gesundheit, Universität & Studium

Seller's business information

AHA-BUCH GmbH

Garlebsen 48
Einbeck, Germany 37574