Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering

Language: English

Published by Berlin Springer International Publishing Springer Mai 2018, 2018

3319778714 / 9783319778716

Series: Book 50 of 74 - Springer Series in Advanced Manufacturing

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Seller: BuchWeltWeit Ludwig Meier e.K., Bergisch Gladbach, GermanyBuchWeltWeit Ludwig Meier e.K.

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This item is printed on demand - it takes 3-4 days longer - Neuware -This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology. 115 pp. Englisch.…

Seller Inventory # 9783319778716

Title
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
Author
Seonho Seok
Publisher
Berlin Springer International Publishing Springer Mai 2018
Publication year
2018
Condition
Neu
Binding
Buch
Language
English
ISBN 10
3319778714
ISBN 13
9783319778716
Item weight
344 grams
Dimensions
245x157x11 mm
Series
Book 50 of 74: Springer Series in Advanced Manufacturing

BuchWeltWeit Ludwig Meier e.K.

Bergisch Gladbach, Germany

5-star seller

AbeBooks seller since January 11, 2012

Shipping rates from Germany to U.S.A.

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BuchWeltWeit Ludwig Meier e.K.

Germany