Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering

Language: English

Published by Springer International Publishing, Springer International Publishing Jan 2019, 2019

3030085619 / 9783030085612

Series: Book 50 of 74 - Springer Series in Advanced Manufacturing

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Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germanybuchversandmimpf2000

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This item is printed on demand - Print on Demand Titel. Neuware -This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films ¿ a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure.Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load¿displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 124 pp. Englisch.…

Seller Inventory # 9783030085612

Title
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering
Author
Seonho Seok
Publisher
Springer International Publishing, Springer International Publishing Jan 2019
Publication year
2019
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
3030085619
ISBN 13
9783030085612
Item weight
201 grams
Dimensions
235x155x8 mm
Series
Book 50 of 74: Springer Series in Advanced Manufacturing

buchversandmimpf2000

Emtmannsberg, BAYE, Germany

5-star seller

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Impressum Thorsten Retsch Buchversand Mimpf2000 Oberölschnitz 16 95517 Emtmannsberg Deutschland Telefon: 09209-2023188 Email: mimpf2000@online.de USt-ID-Nr.: DE 235096871 Wir führen gebrauchte Bücher aus allen Sparten der Literatur

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