Advanced electronic packaging technology series. flip chip packaging technology(Chinese Edition)

TANG HE MING . LAI YI SHAO DENG BIAN

ISBN 10: 712227683X ISBN 13: 9787122276834
Condition: New Soft cover

Sold by liu xing, Nanjing, JS, China

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New - Soft cover

Condition: New

Price:
US$ 216.50
US$ 18.00 shipping
Ships from China to U.S.A.

Quantity: 3 available

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