Advances In Geometric Modeling And Processing

GeometricModelingandProcessing(GMP)isabiennialinternationalconference on geometric modeling, simulation and computing, which provides researchers and practitioners with a forum for exchanging new ideas, discussing new app- cations, and presenting new solutions. Previous GMP conferences were held in Pittsburgh (2006), Beijing (2004), Tokyo (2002), and Hong Kong (2000). This, the 5th GMP conference, was held in Hangzhou, one of the most beautiful cities in China. GMP 2008 received 113 paper submissions, covering a wide spectrum of - ometric modeling and processing, such as curves and surfaces, digital geometry processing, geometric feature modeling and recognition, geometric constraint solving, geometric optimization, multiresolution modeling, and applications in computer vision, image processing, scienti?c visualization, robotics and reverse engineering. Each paper was reviewed by at least three members of the program committee andexternalreviewers.Basedonthe recommendations ofthe revi- ers, 34 regular papers were selected for oral presentation, and 17 short papers were selected for poster presentation. All selected papers are included in these proceedings. We thank all authors, external reviewers and program committee members for their great e?ort and contributions, which made this conference a success.

This book constitutes the refereed proceedings of the 5th International Conference on Geometric Modeling and Processing, GMP 2008, held in Hangzhou, China, in April 2008.

The 34 revised full papers and 17 revised short papers presented were carefully reviewed and selected from a total of 113 submissions. The papers cover a wide spectrum in the area of geometric modeling and processing and address topics such as curves and surfaces, digital geometry processing, geometric feature modeling and recognition, geometric constraint solving, geometric optimization, multiresolution modeling, and applications in computer vision, image processing, scientific visualization, robotics and reverse engineering.