Title: Advances in Thermal Modeling of Electronic Components and Systems. Volume 1
Publisher: Hemisphere Publishing Company
Publication Date: 1988
Language: English
ISBN 10: 0891166890
ISBN 13: 9780891166894
Binding: hardcover
Weight: 32 ounces

About this title

Synopsis

By Avram Bar-Cohen and Allan D. Kraus The explosive growth in chip power dissipation, resulting from greater transistor density and electronic functionality, has spawned numerous studies of thermal control techniques for single chip packages and multichip modules. This book presents current information Air and liquid cooling; Extended surface arrays; and Heat sinks. In addition, it offers a critical review of recent technical and patent literature in electronics cooling. This text is of special value to program managers, technologist and packaging engineers in the electronics industry; and researchers in University and government laboratories.

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