Applications of Process Engineering Principles in Materials Processing, Energy and Environmental Technologies | An EPD Symposium in Honor of Professor Ramana G. Reddy
Shijie Wang (u. a.)
ISBN 10: 3319845632 ISBN 13: 9783319845630
Published by Springer, 2018
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Applications of Process Engineering Principles in Materials Processing, Energy and Environmental Technologies | An EPD Symposium in Honor of Professor Ramana G. Reddy | Shijie Wang (u. a.) | Taschenbuch | xvi | Englisch | 2018 | Springer | EAN 9783319845630 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. Seller Inventory # 114227593
Synopsis:
This collection offers new research findings, innovations, and industrial technological developments in extractive metallurgy, energy and environment, and materials processing.
Technical topics included in the book are thermodynamics and kinetics of metallurgical reactions, electrochemical processing of materials, plasma processing of materials, composite materials, ionic liquids, thermal energy storage, energy efficient and environmental cleaner technologies and process modeling. These topics are of interest not only to traditional base ferrous and non-ferrous metal industrial processes but also to new and upcoming technologies, and they play important roles in industrial growth and economy worldwide.
About the Author: The Minerals, Metals & Materials Society (TMS) is a member-driven international professional society dedicated to fostering the exchange of learning and ideas across the entire range of materials science and engineering, from minerals processing and primary metals production, to basic research and the advanced applications of materials. Included among its nearly 13,000 professional and student members are metallurgical and materials engineers, scientists, researchers, educators, and administrators from more than 70 countries on six continents.
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Bibliographic Details
Title: Applications of Process Engineering ...
Publisher: Springer
Publication Date: 2018
Binding: Taschenbuch
Condition: Neu