Atomistic Modeling of Materials Failure
Buehler, Markus J.
Sold by Kennys Bookstore, Olney, MD, U.S.A.
AbeBooks Seller since October 9, 2009
New - Soft cover
Condition: New
Quantity: 15 available
Add to basketSold by Kennys Bookstore, Olney, MD, U.S.A.
AbeBooks Seller since October 9, 2009
Condition: New
Quantity: 15 available
Add to basketNum Pages: 560 pages, 331 black & white illustrations, 20 black & white tables, biography. BIC Classification: PHD; TBN; TGMT. Category: (P) Professional & Vocational. Dimension: 234 x 155 x 30. Weight in Grams: 798. . 2010. 1st ed. Softcover of orig. ed. 2008. Paperback. . . . . Books ship from the US and Ireland.
Seller Inventory # V9781441945518
Atomistic Modeling of Materials Failure is an introduction to molecular and atomistic modeling techniques applied to solid fracture and deformation. Focusing on a variety of brittle, ductile, geometrically confined and biological materials, this detailed overview includes computational methods at the atomic scale, and describes how these techniques can be used to model the dynamics of cracks and other deformation mechanisms.
A full description of molecular dynamics (MD) as a numerical modeling tool covers the use of classical interatomic potentials and implementation of large-scale massively parallelized computing facilities in addition to the general philosophies of model building, simulation, interpretation and analysis of results. Readers will find an analytical discussion of the numerical techniques along with a review of required mathematical and physics fundamentals. Example applications for specific materials (such as silicon, copper, fibrous proteins) are provided as case studies for each of the techniques, areas and problems discussed.
Providing an extensive review of multi-scale modeling techniques that successfully link atomistic and continuum mechanical methods, Atomistic Modeling of Materials Failure is a valuable reference for engineers, materials scientists, and researchers in academia and industry.
Atomistic Modeling of Materials Failure is an introduction to molecular and atomistic modeling techniques applied to solid deformation and fracture. Focusing on a variety of brittle, ductile and geometrically confined materials, this detailed overview includes computational methods at the atomic scale, and describes how these techniques can be used to model the dynamics of cracks, dislocations and other deformation mechanisms.
A full description of molecular dynamics (MD) as a numerical modeling tool covers the use of classical interatomic potentials and implementation of large-scale massively parallelized computing facilities in addition to the general philosophies of model building, simulation, interpretation and analysis of results. Readers will find an analytical discussion of the numerical techniques along with a review of required mathematical and physics fundamentals. Example applications for specific materials (such as silicon, copper) are provided as case studies for each of the techniques, areas and problems discussed.
Providing an extensive review of multi-scale modeling techniques that successfully link atomistic and continuum mechanical methods, Atomistic Modeling of Materials Failure is a valuable reference for engineers, materials scientists, and researchers in academia and industry.
"About this title" may belong to another edition of this title.
We guarantee the condition of every book as it's described on the Abebooks websites.
If you're dissatisfied with your purchase (Incorrect Book/Not as Described/Damaged) or if the order hasn't arrived, you're eligible for a refund within 30 days of the estimated delivery date.
For any queries please use the contact seller link or send an email to books@kennys.ie
Conor Kenny
All books securely packaged. Some books ship from Ireland.
Order quantity | 14 to 20 business days | 13 to 14 business days |
---|---|---|
First item | US$ 10.50 | US$ 21.00 |
Delivery times are set by sellers and vary by carrier and location. Orders passing through Customs may face delays and buyers are responsible for any associated duties or fees. Sellers may contact you regarding additional charges to cover any increased costs to ship your items.