Bio and Nano Packaging Techniques for Electron Devices: Advances in Electronic Device Packaging

This book discusses future trends and developments in electron device packaging and the opportunities of nano and bio techniques as future solutions. It describes the effect of nano-sized particles and cell-based approaches for packaging solutions with their diverse requirements. It offers a comprehensive overview of nano particles and nano composites and their application as packaging functions in electron devices. The importance and challenges of three-dimensional design and computer modeling in nano packaging is discussed; also ways for implementation are described. Solutions for unconventional packaging solutions for metallizations and functionalized surfaces as well as new packaging technologies with high potential for industrial applications are discussed. The book brings together a comprehensive overview of nano scale components and systems comprising electronic, mechanical and optical structures and serves as important reference for industrial and academic researchers.

Prof. Dr.-Ing. habil. Klaus-Juergen Wolter: 1967-1973 Studies in Control Theory at the Technical University Kiev, Ukraine. 1983 Dissertation "Correlation method for vision systems in microelectronics assembly". 1987 University Teaching Qualification (Habilitation). 1989-1973 R&D position the microelectronics industry. 1989 Assistant professor at the Institute of Electronic Technology. 1992 Appointment as Chair of Procedure Technology of Electronics. 1998 – 1999 Sabbatical at Tessera, San Jose, CA, (Wafer-Level-Packaging). Since 2002 Director of the Centre of Microtechnical Manufacturing (ZµP) at TUD. Since 2003 Director of the Electronic Packaging Lab at Dresden University of Technology. Since 2006 Deputy Head at Fraunhofer Institute IZFP Dresden.
Fields of research: Substrate technologies, Assembly technologies of devices, components, MEMS, Joining technologies, Reliability of electronic packages, Non-destructive test methods