Biopolymer–Based Food Packaging: Innovations and T echnology Applications

Explore the latest developments and advancements in biopolymer-based food packaging

In Biopolymer-Based Food Packaging: Innovations and Technology Applications, a team of accomplished researchers delivers a complete, systematic, and sequential account of the contemporary developments in the application of biopolymers for sustainable food packaging. This book introduces the fabrication, characterization as well as benefits arising from the enhanced functionalities of biopolymer-based food packaging materials.

The authors introduce various polysaccharide, protein, and microbial polymer-based food packaging films and coatings, as well as biopolymer-based blends and nanocomposites. Importance of these materials as active and intelligent food packaging systems is also introduced. Finally, the book explores biopolymer-based edible food packaging, and its efficacy in extending the shelf-life of perishable food items using sustainable materials and processes suitable for the future of circular economies around the world.

Readers will also find:

• A thorough introduction to the incorporation of nanomaterials as fillers to improve the physico-chemical, mechanical, thermal, barrier, optical, and antimicrobial properties of food packaging nanocomposites
• Comprehensive discussions of the use of plant-based bioactive compounds, including essential oils, in biopolymer-based food packaging
• Practical examinations of silver and zinc oxide nanoparticles in food packaging
• In-depth treatments of polylactic acid-based composites for food packaging applications

Biopolymer-Based Food Packaging: Innovations and Technology Applications is an invaluable resource for academic researchers and professionals in food packaging and related industries, as well as research scholars, graduate students, and entrepreneurs working and studying in the field of food preservation, environmental safety, and human health with a focus on the sustainable future.

Santosh Kumar, Central Institute of Technology Kokrajhar, Kokrajhar, India.

Avik Mukherjee, Central Institute of Technology Kokrajhar, Kokrajhar, India.

Joydeep Dutta, KTH Royal Institute of Technology, Stockholm, Sweden.