Burrs : Analysis, Control and Removal: Proceedings of the Cirp International Conference on Burrs

In many machining operations burrs cannot be avoided. They can affect the functionality and the safe handling of the workpiece in the subsequent processing, and have to be removed by a special deburring process. Toleration of burrs, which are not part of functional edges, depends on their respective shape and size. High inspection effort is necessary to guarantee the workpiece quality. Therefore, the research results on burrs, with a focus on burr analysis and control as well as on cleanability and burr removal based on the presentations held at the conference are valuable for researchers and engineers in manufacturing development.

Under the guidance of Prof. Dr.-Ing. Jan C. Aurich at the Institute for Manufacturing Technology and Production Systems individual solutions in the field of manufacturing technology are developed. His research activities cover tool development, control and simulation of machining processes in the area of manufacturing technology as well as virtual production engineering and product-service systems in the area of production systems. In the context of cooperation projects, working groups, workshops and training in direct cooperation with individual enterprises solutions in the field of technology transfer are developed for the industrial practice and business challenges.

Professor David Dornfeld has been conducting research on burr formation, edge finishing and cleanability for a number of years and leads an industry consortium supporting work in this area. In addition, his laboratory specializes in research on precision manufacturing with including micromachining, chemical mechanical planarization for semiconductor manufacturing, green and sustainable manufacturing, and sensors and interoperability. He has published over 300 papers in these fields, authored several books and has seven patents based on his research work. He is a consultant on sensors, manufacturing productivity and automation and process modeling and the associated intellectual property issues.