: Este libro t�cnico es una gu�a exhaustiva sobre el dise�o, materiales, procesos, fiabilidad y aplicaciones de los paquetes a escala de chip (CSP). Escrito por los expertos John H. Lau y Ricky S. W. Lee, la obra profundiza en las innovaciones tecnol�gicas necesarias para la miniaturizaci�n de componentes electr�nicos.Es un recurso esencial para ingenieros y profesionales del sector de semiconductores, proporcionando un an�lisis detallado de los desaf�os de fabricaci�n y las soluciones de ingenier�a en el empaquetado de circuitos integrados modernos. EAN: 0639785306085 Tipo: Libros Categor�a: Tecnolog�a|Ciencias T�tulo: Chip scale package Autor: John H. Lau| Ricky S. W. Lee Editorial: McGraw-Hill Idioma: en P�ginas: 500 Formato: tapa dura.

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Bibliographic Details

Title: Chip scale package
Language: English
Condition: Muy bueno

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Hamelyn es una librer�a online ubicada en Madrid con m�s de 700.000 referencias distintas de libros de segunda mano. Todos pasan un exhaustivo control de calidad, reciclando todos aquellos que no se encuentren aptos para su lectura.

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Hamelyn Technologies
C. de los Llanos de Jerez, 1, Coslada, Madrid, 28823, Spain

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