Chiplet Design and Heterogeneous Integration Packaging

John H. Lau

ISBN 10: 9811999198 / ISBN 13: 9789811999192

Published by Springer Nature Singapore, Springer Nature Singapore, 2024

About this Item

Druck auf Anfrage Neuware - Printed after ordering - The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

Seller Inventory # 9789811999192

Bibliographic Details

• Title: Chiplet Design and Heterogeneous Integration Packaging
• Publisher: Springer Nature Singapore, Springer Nature Singapore
• Publication Date: 2024
• Language: English
• ISBN 10: 9811999198
• ISBN 13: 9789811999192
• Binding: Taschenbuch
• Condition: Neu
• Dimensions: 235W x 155H x 28D millimeters 235 millimeters width by 155 millimeters height by 28 millimeters depth
• Weight: 920 grams

About this title

Synopsis

The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

About the Author

For Internal Use Only:

John H Lau, Ph.D., P.E., IEEE Fellow, ASME Fellow, IMAPS Fellow

Unimicron Technology Corporation, John_Lau@unimicron.com

 

SPECIALIZED PROFESSIONAL COMPETENCIES

[1] Design, analysis, materials, process, manufacturing, qualification, reliability, testing, and thermal management of electronic and optoelectronic components and systems. Fan-out/fan-in WLP, MEMS, LED, CIS, TSV, 3D IC integration, heterogeneous integration/SiP and SMT. Leadfree soldering, manufacturing, and solder joint reliability.

[2] Manage R&D teams to develop new and useful technologies for semiconductor advanced packaging.

[3] Provide recent advances and trends in advanced packaging to upper managements and guidance to young engineers and managers.

Over 22 books (all are the first author), 517 peer-reviewed papers (out of which 375 are principal investigator), 40 issued and pending US patents (out of which 25 are principal inventor), and 325 keynotes/lectures.