Chiplet Design and Heterogeneous Integration Packaging (Paperback)
Language: English
Published by Springer Verlag, Singapore, Singapore, 2024
- Softcover
- New
Seller: Grand Eagle Retail, Bensenville, IL, U.S.A.Grand Eagle Retail
AbeBooks seller since October 12, 2005
Condition: New
US$ 138.36
Quantity: 1 available
Add to basketItem description from seller
Paperback. The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.
Seller Inventory # 9789811999192
- Title
- Chiplet Design and Heterogeneous Integration Packaging (Paperback)
- Author
- John H. Lau
- Publisher
- Springer Verlag, Singapore, Singapore
- Publication year
- 2024
- Condition
- new
- Binding
- Paperback
- Language
- English
- ISBN 10
- 9811999198
- ISBN 13
- 9789811999192
"Synopsis" may belong to another edition of this title.
About the Author
John H Lau, Ph.D., P.E., IEEE Fellow, ASME Fellow, IMAPS Fellow
Unimicron Technology Corporation, John_Lau@unimicron.com
SPECIALIZED PROFESSIONAL COMPETENCIES
[1] Design, analysis, materials, process, manufacturing, qualification, reliability, testing, and thermal management of electronic and optoelectronic components and systems. Fan-out/fan-in WLP, MEMS, LED, CIS, TSV, 3D IC integration, heterogeneous integration/SiP and SMT. Leadfree soldering, manufacturing, and solder joint reliability.
[2] Manage R&D teams to develop new and useful technologies for semiconductor advanced packaging.
[3] Provide recent advances and trends in advanced packaging to upper managements and guidance to young engineers and managers.
Over 22 books (all are the first author), 517 peer-reviewed papers (out of which 375 are principal investigator), 40 issued and pending US patents (out of which 25 are principal inventor), and 325 keynotes/lectures.
"About the title" may belong to another edition of this title.
Grand Eagle Retail
Bensenville, IL, U.S.A.
AbeBooks seller since October 12, 2005
Shipping rates within U.S.A.
| Item | 6 to 14 business days | 6 to 16 business days |
|---|---|---|
| First item | US$ 0.00 | US$ 0.00 |
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APOLLO ONLINE CORP.
605 Geddes Street
Wilmington, DE U.S.A. 19805
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