Computational Heat Transfer Analysis of Electronic Equipments: Using Finite Element Analysis Approach

Sharma, Sahil; Mehta, Nirajkumar; Mandalia, Jay

ISBN 10: 6138836197 / ISBN 13: 9786138836193

Published by Scholars' Press, 2019

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Bibliographic Details

• Title: Computational Heat Transfer Analysis of Electronic Equipments: Using Finite Element Analysis Approach
• Publisher: Scholars' Press
• Publication Date: 2019
• Language: English
• ISBN 10: 6138836197
• ISBN 13: 9786138836193
• Binding: Soft cover
• Condition: New

About this title

Synopsis

Due to rapid research in the electronics industry, including a dramatic increase in chip densities and power densities, as well as a continuous decrease in physical dimensions of electronic packages, thermal management is, and will continue to be, one of the most critical areas in electronic product development. It will have a significant impact on the cost, overall design, reliability and performance. The present trend in the electronics industry is to reduce the size and increase the performance of the equipment. The cooling rate of the modern electronic component is one of the prime areas for the application of thermal control techniques. In the present book, the effect of various shapes of cross sections of fins on the motherboard is studied keeping the inlet air velocity, the temperature of the ambient and the heat generation constant. Finite Element Analysis is done to get heat transfer and temperature distribution. This book will be useful for researchers doing research on computational heat transfer specifically for the electronics industry.