Copper-Fundamental Mechanisms for Microelectronic Applications

Shyam P. Murarka, Igor V. Verner, Ronald J. Gutmann

ISBN 10: 0471252565 / ISBN 13: 9780471252566

Published by Wiley-Interscience, 2000

About this Item

: Este libro es una guía completa sobre el estado del arte y la dirección futura de la tecnología de interconexión de cobre. Debido a sus ventajas de rendimiento, la metalización de cobre para la interconexión de circuitos integrados está atrayendo un gran interés en la comunidad de semiconductores en todo el mundo. Los autores se basan en más de una década de participación en la investigación de interconexión de cobre, integrando grandes cantidades de conocimiento disponible y aclarando la conexión entre los principios mecanicistas y las tecnologías relevantes. Cuenta con amplias referencias, tablas y más de 100 ilustraciones, incluyendo el patrón de doble Damasceno necesario para las interconexiones de cobre. EAN: 9780471252566 Tipo: Libros Categoría: Tecnología|Ciencias Título: Copper-Fundamental Mechanisms for Microelectronic Applications Autor: Shyam P. Murarka| Igor V. Verner| Ronald J. Gutmann Editorial: Wiley-Interscience Idioma: en Páginas: 384 Formato: tapa dura.

Seller Inventory # Happ-2026-07-03-7814e135

Bibliographic Details

• Title: Copper-Fundamental Mechanisms for Microelectronic Applications
• Publisher: Wiley-Interscience
• Publication Date: 2000
• Language: English
• ISBN 10: 0471252565
• ISBN 13: 9780471252566
• Binding: Hardcover
• Condition: Bueno

About this title

Synopsis

A complete guide to the state of the art and future direction of copper interconnect technology
Owing to its performance advantages, copper metallization for IC interconnect is attracting tremendous interest in the semiconductor community worldwide. This timely book provides scientists and engineers with a much-needed, comprehensive reference on the fundamentals and applications of this emerging technology. The authors draw on more than a decade of intimate involvement with copper interconnect research, integrating the vast amounts of available knowledge and making clear the connection between mechanistic principles and relevant technologies. In-depth, cutting-edge discussions include:
* The effects of copper in semiconductor materials, especially silicon
* The fundamental chemistry and electro-chemistry of copper
* The effects of copper on insulating materials such as glass and polymers
* Intermetallic and interfacial reactions of copper in layered structures
* Current and projected applications of copper in integrated circuits
Copper-Fundamental Mechanisms for Microelectronic Applications also features extensive references, tables, and over 100 illustrations-including dual Damascene patterning necessary for copper interconnects. It is an excellent resource for anyone seeking to explore the current literature and gain insight into opportunities opening in the field.

About the Author

SHYAM P. MURARKA, PhD, is a professor in the Department of Materials Science and Engineering at the Rensselaer Polytechnic Institute, Troy, New York.

IGOR V. VERNER, PhD, is a professor at Moscow Institute of Electronic Technology (MIET) in Russia.

RONALD J. GUTMANN, PhD, is a professor in the Department of Electrical, Computer, and Systems Engineering at Rensselaer Polytechnic Institute, Troy, New York.