Title: Directions for the Next Generation of MMIC Devices and Systems
Publisher: Springer Nature B.V. Aug 2013
Publication Date: 2013
Language: English
ISBN 10: 1489914811
ISBN 13: 9781489914811
Binding: Taschenbuch
Condition: Neu
Dimensions: 254 millimeters width by 178 millimeters height by 0 millimeters depth
Weight: 740 grams

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Synopsis

Introduction: Scanning the Conference; N.K. Das, H.L. Bertoni. Historical Perspectives on Microwave and Millimeter Wave Integrated Circuits; A.A. Onliner. MAFET THRUST 3: A Revolutionary Program for Solid-State Microwave and Millimeter-Wave Power; E.R. Brown. Systems and Integration: High-Density Microwave Packaging Technology Development for Department of Defense Application; F. Lamb et al. Flip Mounted Power MMICs Packaging Technology; T.C. Tisco Multilayer Vettical Interconnection Technology; F.Y. Colomb. Novel Antennas and Device Technology: Broadbanding Guide-Lines of Strip-Element Microstrip Phased Arrays; A. Hessel U-Slot Patch Wideband Microstrip Antenna; K.F. Lee et al. Surface-Wave Mode Reduction for Rectangular Microstrip Antennas on High-Index Materials; J. Papapolymerou et al. Modeling and CAD: Types of Leaky Dominant Modes and Spectral Gaps on Printed-Circuit Lines; A.A. Oliner 2-D Integral Spectral-Domain Analysis of Leaky Modes in Covered and Uncovered Microstrip Lines; R. Marques, F. Mesa Excitation of Leaky Modes on Printed-Circuit Structures by Practical Feeds: An Investigation of Physical Meaning; F. Mesa et al. 31 Additional Articles. Index.

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