Distributed Computing and Artificial Intelligence, 21st International Conference

This book serves as a forum to present applications of innovative techniques for studying and solving complex problems in artificial intelligence and computing. This edition brings together experience, current work, and promising future trends related to distributed computing, artificial intelligence, and their applications to provide efficient solutions to real-world problems. The technical program this year is both high in quality and diverse, featuring contributions from well-established and evolving research areas. Specifically, 138 papers were submitted by authors from 43 different countries, representing a truly global network of research activity. The DCAI’24 technical program has selected 36 full papers for the main track, and as in previous editions, there will be special issues in ranked journals. This symposium is organized by the University of Salamanca (Spain). The authors would like to thank all the contributing authors, the program committee members, National Associations (AEPIA, APPIA, LASI), and the sponsors (AIR Institute).

This book serves as a forum to present applications of innovative techniques for studying and solving complex problems in artificial intelligence and computing. This edition brings together experience, current work, and promising future trends related to distributed computing, artificial intelligence, and their applications to provide efficient solutions to real-world problems. The technical program this year is both high in quality and diverse, featuring contributions from well-established and evolving research areas. Specifically, 138 papers were submitted by authors from 43 different countries, representing a truly global network of research activity. The DCAI’24 technical program has selected 36 full papers for the main track, and as in previous editions, there will be special issues in ranked journals. This symposium is organized by the University of Salamanca (Spain). The authors would like to thank all the contributing authors, the program committee members, National Associations (AEPIA, APPIA, LASI), and the sponsors (AIR Institute).