ELECTRONICS PACKAGING FORUM MULTICHIP MODULE TECHNOLOGY ISSUES (HB 1994)

MORRIS J E

ISBN 10: 078030439X / ISBN 13: 9780780304390

Published by MISC, 1994

About this Item

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Bibliographic Details

• Title: ELECTRONICS PACKAGING FORUM MULTICHIP MODULE TECHNOLOGY ISSUES (HB 1994)
• Publisher: MISC
• Publication Date: 1994
• Language: English
• ISBN 10: 078030439X
• ISBN 13: 9780780304390
• Binding: Hardcover
• Edition: International Edition
• Condition: New

About this title

Synopsis

Based on presentations at the Electronics Packaging Symposium, held at the State University of New York, Binghamton in May 1991, this practical volume provides a multidisciplinary treatment of the field of electronic packaging and multichip modules. Among the topics covered: building long-term reliability by increasing polyimide stability; recent discoveries in the field of soldering phenomena relating to fundamental fluid mechanical processes; how to use the finite-difference time-domain approach in electromagnetic modeling; and the development of dedicated test chips for package evaluation in varied field conditions. Annotation copyright Book News, Inc. Portland, Or.