Electromagnetic Compatibility of Integrated Circuits
Language: English
Published by Birkhauser Boston Inc, 2014
- Softcover
- New

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Condition: New
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Add to basketItem description from seller
Editor(s): Dhia, Sonia Ben; Ramdani, Mohamed; Sicard, Etienne. Num Pages: 486 pages, biography. BIC Classification: TJF; TJFC; TJFN; TRC; UGC. Category: (G) General (US: Trade). Dimension: 235 x 155 x 25. Weight in Grams: 741. . 2014. Paperback. . . . . Books ship from the US and Ireland.
Seller Inventory # V9781461498315
- Title
- Electromagnetic Compatibility of Integrated Circuits
- Author
- . Ed(s): Dhia, Sonia Ben; Ramdani, Mohamed; Sicard, Etienne
- Publisher
- Birkhauser Boston Inc
- Publication year
- 2014
- Condition
- New
- Binding
- Soft cover
- Language
- English
- ISBN 10
- 1461498317
- ISBN 13
- 9781461498315
Electromagnetic Compatibility of Integrated Circuits: Techniques for Low Emission and Susceptibility focuses on the electromagnetic compatibility of integrated circuits. The basic concepts, theory, and an extensive historical review of integrated circuit emission and susceptibility are provided. Standardized measurement methods are detailed through various case studies. EMC models for the core, I/Os, supply network, and packaging are described with applications to conducted switching noise, signal integrity, near-field and radiated noise. Case studies from different companies and research laboratories are presented with in-depth descriptions of the ICs, test set-ups, and comparisons between measurements and simulations. Specific guidelines for achieving low emission and susceptibility derived from the experience of EMC experts are presented.
"Synopsis" may belong to another edition of this title.
From the Back Cover
Electromagnetic Compatibility of Integrated Circuits: Techniques for Low Emission and Susceptibility focuses on the electromagnetic compatibility of integrated circuits. The basic concepts, theory, and an extensive historical review of integrated circuit emission and susceptibility are provided. Standardized measurement methods are detailed through various case studies. EMC models for the core, I/Os, supply network, and packaging are described with applications to conducted switching noise, signal integrity, near-field and radiated noise. Case studies from different companies and research laboratories are presented with in-depth descriptions of the ICs, test set-ups, and comparisons between measurements and simulations. Specific guidelines for achieving low emission and susceptibility derived from the experience of EMC experts are presented.
"About the title" may belong to another edition of this title.
Kennys Bookstore
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