Electromigration Modeling at Circuit Layout Level

Language: English

Published by Springer Nature Singapore, 2013

9814451207 / 9789814451208

  • Softcover
  • New
See all details

Seller: moluna, Greven, Germanymoluna

5-star seller

AbeBooks seller since July 9, 2020

View this seller's items
Softcover

Condition: New

US$ 57.93

US$ 56.97 shipping 
Ships from Germany to U.S.A.

Quantity: Over 20 available

Add to basket
Free 30-day returns

Item description from seller

Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Highlights a new method which models the interconnects EM reliability in both 3D and circuit layout level Combines Cadence and ANSYS softwares to model interconnect reliability of real 3D circuit made up of complete interconnect structures and surro.

Seller Inventory # 5843195

Title
Electromigration Modeling at Circuit Layout Level
Author
Cher Ming Tan|Feifei He
Publisher
Springer Nature Singapore
Publication year
2013
Condition
New
Binding
Kartoniert / Broschiert
Language
English
ISBN 10
9814451207
ISBN 13
9789814451208

moluna

Greven, Germany

5-star seller

AbeBooks seller since July 9, 2020

Shipping rates from Germany to U.S.A.

Item16 to 45 business days16 to 45 business days
First itemUS$ 56.97US$ 56.97
Delivery times are set by sellers and vary by carrier and location. Orders passing through Customs may face delays and buyers are responsible for any associated duties or fees. Sellers may contact you regarding additional charges to cover any increased costs to ship your items.

Payment methods

  • Visa
  • Mastercard
  • American Express
  • Apple Pay
  • Google Pay
  • Bank Wire Transfer
  • Check
  • Paypal

Store description

Online Handel nur mit Neubüchern

Seller's business information

Moluna GmbH

Engberdingdamm 27
Greven, Germany 48268