Electron Beam Testing Technology

John T L Thong

ISBN 10: 0306443600 / ISBN 13: 9780306443602

Published by Springer Us, 1993

About this Item

Druck auf Anfrage Neuware - Printed after ordering - Although exploratory and developmental activity in electron beam testing (EBT) 25 years, it was not had already been in existence in research laboratories for over until the beginning of the 1980s that it was taken up seriously as a technique for integrated circuit (IC) testing. While ICs were being fabricated on design rules of several microns, the mechanical ne edle probe served quite adequately for internal chip probing. This scenario changed with growing device complexity and shrinking geometries, prompting IC manufacturers to take note ofthis new testing technology. It required several more years and considerable investment by electron beam tester manufacturers, however, to co me up with user-friendly automated systems that were acceptable to IC test engineers. These intervening years witnessed intense activity in the development of instrumentation, testing techniques, and system automation, as evidenced by the proliferation of technical papers presented at conferences. With the shift of interest toward applications, the technology may now be considered as having come of age.

Seller Inventory # 9780306443602

Bibliographic Details

• Title: Electron Beam Testing Technology
• Publisher: Springer Us
• Publication Date: 1993
• Language: English
• ISBN 10: 0306443600
• ISBN 13: 9780306443602
• Binding: Buch
• Condition: Neu
• Dimensions: 254W x 178H x 27D millimeters 254 millimeters width by 178 millimeters height by 27 millimeters depth
• Weight: 1052 grams

About this title

Synopsis

Although exploratory and developmental activity in electron beam testing (EBT) 25 years, it was not had already been in existence in research laboratories for over until the beginning of the 1980s that it was taken up seriously as a technique for integrated circuit (IC) testing. While ICs were being fabricated on design rules of several microns, the mechanical ne edle probe served quite adequately for internal chip probing. This scenario changed with growing device complexity and shrinking geometries, prompting IC manufacturers to take note ofthis new testing technology. It required several more years and considerable investment by electron beam tester manufacturers, however, to co me up with user-friendly automated systems that were acceptable to IC test engineers. These intervening years witnessed intense activity in the development of instrumentation, testing techniques, and system automation, as evidenced by the proliferation of technical papers presented at conferences. With the shift of interest toward applications, the technology may now be considered as having come of age.