Electron Beam Testing Technology

John T. L. Thong

ISBN 10: 1489915249 / ISBN 13: 9781489915245

Published by Springer, Springer US Jun 2013, 2013

About this Item

This item is printed on demand - Print on Demand Titel. Neuware -Although exploratory and developmental activity in electron beam testing (EBT) 25 years, it was not had already been in existence in research laboratories for over until the beginning of the 1980s that it was taken up seriously as a technique for integrated circuit (IC) testing. While ICs were being fabricated on design rules of several microns, the mechanical ne edle probe served quite adequately for internal chip probing. This scenario changed with growing device complexity and shrinking geometries, prompting IC manufacturers to take note ofthis new testing technology. It required several more years and considerable investment by electron beam tester manufacturers, however, to co me up with user-friendly automated systems that were acceptable to IC test engineers. These intervening years witnessed intense activity in the development of instrumentation, testing techniques, and system automation, as evidenced by the proliferation of technical papers presented at conferences. With the shift of interest toward applications, the technology may now be considered as having come of age.Libri GmbH, Europaallee 1, 36244 Bad Hersfeld 480 pp. Englisch.

Seller Inventory # 9781489915245

Bibliographic Details

• Title: Electron Beam Testing Technology
• Publisher: Springer, Springer US Jun 2013
• Publication Date: 2013
• Language: English
• ISBN 10: 1489915249
• ISBN 13: 9781489915245
• Binding: Taschenbuch
• Condition: Neu
• Dimensions: 254W x 178H x 26D millimeters 254 millimeters width by 178 millimeters height by 26 millimeters depth
• Weight: 895 grams

About this title

Synopsis

Although exploratory and developmental activity in electron beam testing (EBT) 25 years, it was not had already been in existence in research laboratories for over until the beginning of the 1980s that it was taken up seriously as a technique for integrated circuit (IC) testing. While ICs were being fabricated on design rules of several microns, the mechanical ne edle probe served quite adequately for internal chip probing. This scenario changed with growing device complexity and shrinking geometries, prompting IC manufacturers to take note ofthis new testing technology. It required several more years and considerable investment by electron beam tester manufacturers, however, to co me up with user-friendly automated systems that were acceptable to IC test engineers. These intervening years witnessed intense activity in the development of instrumentation, testing techniques, and system automation, as evidenced by the proliferation of technical papers presented at conferences. With the shift of interest toward applications, the technology may now be considered as having come of age.