Electronic Packaging: Design, Materials, Process, and Reliability

Lau, John H.; Wong, C.P.; Prince, J.L.

ISBN 10: 0070371350 / ISBN 13: 9780070371354

Published by McGraw-Hill Professional, 1998

About this Item

Book is in good condition. Minimal signs of wear. It May have markings or highlights, but kept to only a few pages. May not come with supplemental materials if applicable.

Seller Inventory # LFM.5907

Bibliographic Details

• Title: Electronic Packaging: Design, Materials, Process, and Reliability
• Publisher: McGraw-Hill Professional
• Publication Date: 1998
• Language: English
• ISBN 10: 0070371350
• ISBN 13: 9780070371354
• Binding: Hardcover
• Condition: good

About this title

Synopsis

The ultimate, up-to-the-minute electronic packaging resource

The ever-increasing pin counts and clock speeds of modern electronics continue to "push the performance envelope" with regard to designing packaging and interconnection solutions that can meet increasingly challenging requirements. Here's the help you need!

For the first time, four well-known experts representing the four relevant fields--mechanical engineering, electrical engineering, thermal management, and materials--team up to provide a single-volume comprehensive reference that explains packaging and interconnection basics, details design tradeoff considerations, and presents specific system-level solutions. This unprecedented and unsurpassed multi-disciplinary coverage not only includes all the new technologies--BGA, Flip Chip, DCA, and CSP--it shows how they can be most effectively integrated.

With its clear explication of both theoretical and practical issues, Electronic Packaging will be of considerable and continuing value if you hope to design and/or refine more reliable, robust, and cost-effective packaging solutions for virtually any interconnect system.

About the Author

Dr. John H. Lau is President of Express Packaging Systems, Inc. He previously worked for Hewlett-Packard Company. Dr. C.P. Wong is a professor of Materials Science and Engineering at the Georgia Institute of technology. He is a past President of the IEEE-CPMT Society and has done research at AT&T. Dr. John Prince is Professor of Electrical and Computer Engineering and Director of the Center for Electronic Packaging Research at the University of Arizona. Dr. Warren Nakayama is a professor at the CALCE Electronic Packaging Research Center at the University of Maryland. He previously worked for Hitachi Ltd.