Electronic Packaging for High Reliability, Low Cost Electronics (Nato Science Partnership Sub-Series: 3)

R. R. Tummala

ISBN 10: 904815085X / ISBN 13: 9789048150854

Published by Springer, 2000

About this Item

296 pages. 9.25x6.10x0.70 inches. In Stock.

Seller Inventory # zk904815085X

Bibliographic Details

• Title: Electronic Packaging for High Reliability, Low Cost Electronics (Nato Science Partnership Sub-Series: 3)
• Publisher: Springer
• Publication Date: 2000
• Language: English
• ISBN 10: 904815085X
• ISBN 13: 9789048150854
• Binding: Paperback
• Condition: Brand New
• Weight: 0.47 kilograms

About this title

Synopsis

Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.