Electronic Packaging for High Reliability, Low Cost Electronics (Nato Science Partnership Subseries: 3 (57))

ISBN 10: 904815085X / ISBN 13: 9789048150854

Published by Springer, 2010

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Bibliographic Details

• Title: Electronic Packaging for High Reliability, Low Cost Electronics (Nato Science Partnership Subseries: 3 (57))
• Publisher: Springer
• Publication Date: 2010
• Language: English
• ISBN 10: 904815085X
• ISBN 13: 9789048150854
• Binding: Paperback
• Condition: Like New
• Book Type: book

About this title

Synopsis

Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.