Electronic Packaging for High Reliability, Low Cost Electronics

Language: English

Published by Springer Netherlands, Springer Dez 2010, 2010

904815085X / 9789048150854

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This item is printed on demand - Print on Demand Titel. Neuware -Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.Springer-Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg 308 pp. Englisch.

Seller Inventory # 9789048150854

Title
Electronic Packaging for High Reliability, Low Cost Electronics
Author
R. R. Tummala
Publisher
Springer Netherlands, Springer Dez 2010
Publication year
2010
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
904815085X
ISBN 13
9789048150854
Item weight
470 grams
Dimensions
235x155x17 mm

buchversandmimpf2000

Emtmannsberg, BAYE, Germany

5-star seller

AbeBooks seller since January 23, 2017

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