Electronic Packaging and Interconnection Handbook (Electronic Packaging and Interconnection Series)

Whether you're designing an electronic system from scratch or engineering the project from someone else's design, the Handbook gives you the tools you need to get the job done faster, cheaper and more reliably than ever. We guarantee it. From development and design to manufacturing and testing, the Handbook has you covered. It's the one resource to turn to first. Why not put it to the test and see for yourself?

Electronic Packaging & Interconnection Handbook Widely regarded as the definitive resource in the field, Electronic Packaging & Interconnection Handbook, now in a thoroughly revised Second Edition, features over 50% all-new information, plus updated material on other major developments in high-performance packaging. Here is the latest practical insight into such vital new areas as advanced single and multichip packaging, ball grid array, flip chip packaging, chip scale packaging, and packaging microwave, high-speed and high-voltage electronics, in addition to cutting-edge analysis of advances in surface mount and soldering technologies. Distinguised specialists come together to cover all the fundamentals-from design to testing-as well as all connector and interconnection technologies and all types of electronics systems, providing-for the first time in any book-and integrated set of data and guidelines for packagers to use. Relying on the Handbook, practitioners will be better able to: optimize the mechanical and thermal design of electronic packages; Select the highest-yield, lowest-cost manufacturing processes, materials, and controls; Develop new markets for existing products; Create new products for emerging electronics systems. Featuring more than 600 illustrations, the Second Edition of this benchmark tool will be indispensible in assuring the development of more reliable, more manufacturable, and more cost-effective electronic packages and, finally, systems.