Paperback. Pub Date: 2006 Pages: 635 Publisher: Chemical Industry Press book by the work of experts in various fields in the first line of the electronic package written concerning electronic packaging materials and technology and related fields. including semiconductor. plastics . rubber. composite materials. ceramics and glass. and metal and other materials. the material also including soldering of electronic packaging and assembly. electroplating and depositing a metal coating. the manufac.

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Bibliographic Details

Title: Electronic Packaging Materials and Processes (3) of the original(Chinese Edition)
Publisher: Chemistry Industry Press
Publication Date: 2000
ISBN 10: 7502579796
ISBN 13: 9787502579791
Binding: paperback
Condition: New

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Language:Chinese.Soft cover.publisher:Chemistry Industry Press.description:Paperback. Publisher: Chemical Industry

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