Electronics Packaging Forum : Volume Two

James E. Morris

ISBN 10: 9401066817 / ISBN 13: 9789401066815

Published by Springer, Springer, 2011

About this Item

Druck auf Anfrage Neuware - Printed after ordering - Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.

Seller Inventory # 9789401066815

Bibliographic Details

• Title: Electronics Packaging Forum : Volume Two
• Publisher: Springer, Springer
• Publication Date: 2011
• Language: English
• ISBN 10: 9401066817
• ISBN 13: 9789401066815
• Binding: Taschenbuch
• Condition: Neu
• Dimensions: 229W x 152H x 26D millimeters 229 millimeters width by 152 millimeters height by 26 millimeters depth
• Weight: 678 grams

About this title

Synopsis

Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.