Emerging Memory and Computing Devices in the Era of Intelligent Machines

ISBN 10: 3039285025 / ISBN 13: 9783039285020

Published by MDPI AG, 2020

About this Item

Emerging Memory and Computing Devices in the Era of Intelligent Machines | Taschenbuch | Kartoniert / Broschiert | Englisch | 2020 | MDPI AG | EAN 9783039285020 | Verantwortliche Person für die EU: Libri GmbH, Europaallee 1, 36244 Bad Hersfeld, gpsr[at]libri[dot]de | Anbieter: preigu Print on Demand.

Seller Inventory # 118237310

Bibliographic Details

• Title: Emerging Memory and Computing Devices in the Era of Intelligent Machines
• Publisher: MDPI AG
• Publication Date: 2020
• Language: English
• ISBN 10: 3039285025
• ISBN 13: 9783039285020
• Binding: Taschenbuch
• Condition: Neu
• Dimensions: 244W x 170H x 18D millimeters 244 millimeters width by 170 millimeters height by 18 millimeters depth
• Weight: 711 grams
• Seller catalogs:
  • Bücher

About this title

Synopsis

Computing systems are undergoing a transformation from logic-centric towards memory-centric architectures, where overall performance and energy efficiency at the system level are determined by the density, performance, functionality and efficiency of the memory, rather than the logic sub-system. This is driven by the requirements of data-intensive applications in artificial intelligence, autonomous systems, and edge computing. We are at an exciting time in the semiconductor industry where several innovative device and technology concepts are being developed to respond to these demands, and capture shares of the fast growing market for AI-related hardware. This special issue is devoted to highlighting, discussing and presenting the latest advancements in this area, drawing on the best work on emerging memory devices including magnetic, resistive, phase change, and other types of memory. The special issue is interested in work that presents concepts, ideas, and recent progress ranging from materials, to memory devices, physics of switching mechanisms, circuits, and system applications, as well as progress in modeling and design tools. Contributions that bridge across several of these layers are especially encouraged.