Set 1: Thermal Packaging Techniques
Thermal and mechanical packaging — the enabling technologies for the physical implementation of electronic systems — are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.
Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.
Set 2: Thermal Packaging Tools
The second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions.
The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging “learning curve,” the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.
Readership: Packaging engineers, electronic product development engineers, and product managers, as well as researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.
Dr Avram Bar-Cohen is an internationally recognized leader in thermal science and technology, an Honorary member of ASME, and Fellow of IEEE, as well as Distinguished University Professor in the Department of Mechanical Engineering at the University of Maryland. His publications, lectures, short courses, and research, as well as through his role at the Defense Advanced Projects Agency (DARPA) and professional service in ASME and IEEE, have helped to create the scientific foundation for the thermal management of electronic components and systems. His current research focuses on embedded cooling, including on-chip thermoelectric and two-phase microchannel coolers for high heat flux electronic components, thermal control of solid-state lighting and directed energy systems, and polymer-fiber composite heat exchangers for seawater applications.
Bar-Cohen was the general chair of the highly successful 2010 International Heat Transfer Conference in Washington, DC and is the immediate past President of the Assembly of International Heat Transfer Conferences. He serves on the Board of Governors of the IEEE CPMT Society and has previously served on several ASME Society Boards, as well as a 3-year term as VP of Reseach. From 1998 to 2001 he directed the University of Minnesota Center for the Development of Technological Leadership and held the Sweatt Chair in Technological Leadership. From 2001 to 2010 he served as the Chair of Mechanical Engineering at Maryland and is currently on assignment as a Program Manager in the Microsystem Technology Office at the Defense Advanced Projects Agency in Virginia.
In 2014 Bar-Cohen was honored by the IEEE with the prestigious CPMT Field Award and had earlier been recognized with the CPMT Society's Outstanding Sustained Technical Contributions Award (2002), the ITHERM Achievement Award (1998) and the THERMI Award (1997). In addition to Honorary membership in ASME, Bar-Cohen received the Luikov Medal from the International Center for Heat and Mass Transfer in Turkey (2008), ASME's Heat Transfer Memorial Award (1999), Curriculum Innovation Award (1999), Edwin F Church Medal (1994), Worcester Reed Warner Medal (2000), and the Electronic and Electrical Packaging Division's Outstanding Contribution Award (1994), as well as the InterPack Achievement Award (2007). Bar-Cohen was instrumental in elevating ASME's InterPack Conference to its premier status in the packaging community and was the founding chair of the IEEE Intersociety Conference on Thermal Management in Electronic Equipment (ITHERM) in 1988.
In addition to serving as the Editor-in-Chief of WSPC's Encyclopedia of Thermal Packaging and the co-editor of the Advanced Integration and Packaging book series, Bar-Cohen has co-authored Dielectric Liquid Cooling of Immersed Components (WSPC, 2013), Design and Analysis of Heat Sinks (Wiley 1995), and Thermal Analysis and Control of Electronic Equipment (McGraw-Hill, 1983), and has edited/co-edited 24 books in this field. He has authored/co-authored nearly 400 journal papers, refereed proceedings papers, and chapters in books; has delivered 95 keynote, plenary and invited lectures at major technical conferences and institutions; and he holds 8 US and 3 Japanese patents. He has advised to completion 67 master's and PhD students at the University of Maryland, the University of Minnesota and the Ben Gurion University (Beer Sheva, Israel), where he began his academic career in 1972.
