Fan-out wafer-level packaging. panel-level packaging and embedded technology: High-performance computing (HPC) and system-in-package (SiP)(Chinese Edition)
Language: English
Published by Mechanical Industry Press, 2024
- Softcover
- New
Condition: New
US$ 159.33
Quantity: 3 available
Add to basketItem description from seller
Language:Chinese.Paperback. Pub Date: 2024-06 Pages: 268 Publisher: China Machine Press The book Fan-out Wafer-Level Packaging. Board-Level Packaging and Embedding Technology was written by Dr. Beth Keser. former president of the International Microelectronics Assembly and Packaging Society (IMAPS). and translated by the 43rd Institute of China Electronics Technology Group Corporation. Fan-out Wafer-Level Packaging. Board-Level Packaging and Embedding Technology explains various fan-out and e.
Seller Inventory # DR009393
- Title
- Fan-out wafer-level packaging. panel-level packaging and embedded technology: High-performance computing (HPC) and system-in-package (SiP)(Chinese Edition)
- Author
- [ MEI ] BEI SI· KAI SE ( Beth Keser ) . [ DE ] SI DI FEN· KE LUO NA TE
- Publisher
- Mechanical Industry Press
- Publication year
- 2024
- Condition
- New
- Binding
- paperback
- Language
- English
- ISBN 10
- 7111755804
- ISBN 13
- 9787111755807
"Synopsis" may belong to another edition of this title.
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| Item | 16 to 30 business days | 8 to 16 business days |
|---|---|---|
| First item | US$ 18.00 | US$ 30.00 |
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