Fan-out wafer-level packaging. panel-level packaging and embedded technology: High-performance computing (HPC) and system-in-package (SiP)(Chinese Edition)

[ MEI ] BEI SI&amp#183; KAI SE ( Beth Keser ) . [ DE ] SI DI FEN&amp#183; KE LUO NA TE

ISBN 10: 7111755804 / ISBN 13: 9787111755807

Published by Mechanical Industry Press, 2024

About this Item

Language:Chinese.Paperback. Pub Date: 2024-06 Pages: 268 Publisher: China Machine Press The book Fan-out Wafer-Level Packaging. Board-Level Packaging and Embedding Technology was written by Dr. Beth Keser. former president of the International Microelectronics Assembly and Packaging Society (IMAPS). and translated by the 43rd Institute of China Electronics Technology Group Corporation. Fan-out Wafer-Level Packaging. Board-Level Packaging and Embedding Technology explains various fan-out and e.

Seller Inventory # DR009393

Bibliographic Details

• Title: Fan-out wafer-level packaging. panel-level packaging and embedded technology: High-performance computing (HPC) and system-in-package (SiP)(Chinese Edition)
• Publisher: Mechanical Industry Press
• Publication Date: 2024
• Language: English
• ISBN 10: 7111755804
• ISBN 13: 9787111755807
• Binding: paperback
• Condition: New

About this title

Synopsis

Language:Chinese.paperback.Pub Date:2024-06.publisher:Mechanical Industry Press.description:Paperback. Pub Date: 2024-06 Pages: 268 Publisher: China Machine Press The book Fan-out Wafer-Level Packaging. Board-Level Packaging and Embedding Technology was written by Dr. Beth Keser. former president of the International Microelectronics Assemb