Foldable Flex and Thinned Silicon Multichip Packaging Technology

Language: English

Published by Springer US, 2014

146134977X / 9781461349778

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  • New
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Seller: moluna, Greven, Germanymoluna

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Dieser Artikel ist ein Print on Demand Artikel und wird nach Ihrer Bestellung fuer Sie gedruckt. Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits.

Seller Inventory # 4193219

Title
Foldable Flex and Thinned Silicon Multichip Packaging Technology
Author
Balde, John W.
Publisher
Springer US
Publication year
2014
Condition
New
Binding
Soft cover
Language
English
ISBN 10
146134977X
ISBN 13
9781461349778

moluna

Greven, Germany

5-star seller

AbeBooks seller since July 9, 2020

Shipping rates from Germany to U.S.A.

Item16 to 45 business days16 to 45 business days
First itemUS$ 55.76US$ 55.76
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Greven, Germany 48268