Foldable Flex and Thinned Silicon Multichip Packaging Technology

Language: English

Published by Springer US, 2003

0792376765 / 9780792376767

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Seller: moluna, Greven, Germanymoluna

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Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits.

Seller Inventory # 458442180

Title
Foldable Flex and Thinned Silicon Multichip Packaging Technology
Author
Balde, John W.
Publisher
Springer US
Publication year
2003
Condition
New
Binding
Gebunden
Language
English
ISBN 10
0792376765
ISBN 13
9780792376767

moluna

Greven, Germany

5-star seller

AbeBooks seller since July 9, 2020

Shipping rates from Germany to U.S.A.

Item26 to 60 business days26 to 60 business days
First itemUS$ 56.77US$ 56.77
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Moluna GmbH

Engberdingdamm 27
Greven, Germany 48268