Foldable Flex and Thinned Silicon Multichip Packaging Technology
Language: English
Published by Springer, 2014
- Softcover
- New
Seller: Books Puddle, Woodside, NY, U.S.A.Books Puddle
AbeBooks seller since November 22, 2018
Condition: New
US$ 239.00
Quantity: 4 available
Add to basketItem description from seller
pp. 372.
Seller Inventory # 26357317766
- Title
- Foldable Flex and Thinned Silicon Multichip Packaging Technology
- Publisher
- Springer
- Publication year
- 2014
- Condition
- New
- Binding
- Soft cover
- Language
- English
- ISBN 10
- 146134977X
- ISBN 13
- 9781461349778
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.
"Synopsis" may belong to another edition of this title.
Review
(David W Palmer, Manager Microsystems Applications, Sandia National Laboratories)
"About the title" may belong to another edition of this title.
Books Puddle
Woodside, NY, U.S.A.
AbeBooks seller since November 22, 2018
Shipping rates within U.S.A.
| Item | 12 to 19 business days | 12 to 14 business days |
|---|---|---|
| First item | US$ 3.99 | US$ 6.99 |
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I mainly carry imported books from South East Asia / South Asia for readers of all Age Groups.
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South Asian and South East Asian Culture, Religion, Art etcSeller's business information
PLETOS INC
6931 51st Avenue, WOODSIDE
Woodside, NY U.S.A. 11377
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We accept return for those books which are received damaged. Though we take appropriate care in packing to avoid such situation.