Foldable Flex and Thinned Silicon Multichip Packaging Technology
Language: English
Published by Springer, 2014
- Softcover
- New
Seller: Majestic Books, Hounslow, United KingdomMajestic Books
AbeBooks seller since January 19, 2007
Condition: New
US$ 248.04
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Print on Demand pp. 372 49:B&W 6.14 x 9.21 in or 234 x 156 mm (Royal 8vo) Perfect Bound on White w/Gloss Lam.
Seller Inventory # 356221785
- Title
- Foldable Flex and Thinned Silicon Multichip Packaging Technology
- Publisher
- Springer
- Publication year
- 2014
- Condition
- New
- Binding
- Soft cover
- Language
- English
- ISBN 10
- 146134977X
- ISBN 13
- 9781461349778
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.
"Synopsis" may belong to another edition of this title.
Review
(David W Palmer, Manager Microsystems Applications, Sandia National Laboratories)
"About the title" may belong to another edition of this title.
Majestic Books
Hounslow, United Kingdom
AbeBooks seller since January 19, 2007
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