Zustand: Sehr gut | Seiten: 376 | Sprache: Englisch | Produktart: B�cher | Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

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Bibliographic Details

Title

Foldable Flex and Thinned Silicon Multichip Packaging Technology

Publisher

Springer Nature B.V.

Publication Date

2003

Language

English

ISBN 10

0792376765

ISBN 13

9780792376767

Binding

Hardcover

Condition

Sehr gut

Seller catalogs

B�cher

About this title

Synopsis

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

Review

"If you are responsible for deciding on the next generation of packaging that will be used for your company's application or are steering university research and want to find high impact focus, this book is a must read....By placing all this information between two covers and having the various perspectives of the many authors clash and add to each other (and providing access to the authors), the reader is placed in a knowledgeable position from which to make their own technology investment decisions in this 3D world."
(David W Palmer, Manager Microsystems Applications, Sandia National Laboratories)

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Shipping rates from Germany to U.S.A.
Order quantity	60 to 60 business days	60 to 60 business days
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