Foldable Flex and Thinned Silicon Multichip Packaging Technology
Language: English
Published by Springer, 2014
- Softcover
- New
Seller: Biblios, frankfurt am main, hessen, GermanyBiblios
AbeBooks seller since September 10, 2024
Condition: New
US$ 266.03
Quantity: 4 available
Add to basketItem description from seller
PRINT ON DEMAND pp. 372.
Seller Inventory # 18357317772
- Title
- Foldable Flex and Thinned Silicon Multichip Packaging Technology
- Author
- Balde John W.
- Publisher
- Springer
- Publication year
- 2014
- Condition
- New
- Binding
- Soft cover
- Language
- English
- ISBN 10
- 146134977X
- ISBN 13
- 9781461349778
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.
"Synopsis" may belong to another edition of this title.
Review
(David W Palmer, Manager Microsystems Applications, Sandia National Laboratories)
"About the title" may belong to another edition of this title.
Biblios
frankfurt am main, hessen, Germany
AbeBooks seller since September 10, 2024
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