Foldable Flex and Thinned Silicon Multichip Packaging Technology (Emerging Technology in Advanced Packaging, 1). This item is unavailable.
Language: English
Published by Springer, 2003
- Hardcover
- New
Seller: Ria Christie Collections, Uxbridge, United KingdomRia Christie Collections
AbeBooks seller since March 25, 2015
Condition: New
US$ 208.67
Item description from seller
In English.
Seller Inventory # ria9780792376767_new
- Title
- Foldable Flex and Thinned Silicon Multichip Packaging Technology (Emerging Technology in Advanced Packaging, 1)
- Publisher
- Springer
- Publication year
- 2003
- Condition
- New
- Binding
- Hardcover
- Language
- English
- ISBN 10
- 0792376765
- ISBN 13
- 9780792376767
- Item weight
- 824 grams
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.
"Synopsis" may belong to another edition of this title.
Review
(David W Palmer, Manager Microsystems Applications, Sandia National Laboratories)
"About the title" may belong to another edition of this title.