Foldable Flex and Thinned Silicon Multichip Packaging Technology

John W. Balde

ISBN 10: 146134977X / ISBN 13: 9781461349778

Published by Springer US, 2014

Foldable Flex and Thinned Silicon Multichip Packaging Technology | John W. Balde | Taschenbuch | xix | Englisch | 2014 | Springer US | EAN 9781461349778 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu. Seller Inventory # 105125119

Synopsis:

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

Review: "If you are responsible for deciding on the next generation of packaging that will be used for your company's application or are steering university research and want to find high impact focus, this book is a must read....By placing all this information between two covers and having the various perspectives of the many authors clash and add to each other (and providing access to the authors), the reader is placed in a knowledgeable position from which to make their own technology investment decisions in this 3D world."
(David W Palmer, Manager Microsystems Applications, Sandia National Laboratories)

Bibliographic Details

Title: Foldable Flex and Thinned Silicon Multichip ...
Publisher: Springer US
Publication Date: 2014
Binding: Taschenbuch
Condition: Neu