Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach

Farhang Yazdani

ISBN 10: 3030093239 / ISBN 13: 9783030093235

Published by Springer International Publishing, 2018

About this Item

Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach | Farhang Yazdani | Taschenbuch | x | Englisch | 2018 | Springer International Publishing | EAN 9783030093235 | Verantwortliche Person für die EU: Springer Verlag GmbH, Tiergartenstr. 17, 69121 Heidelberg, juergen[dot]hartmann[at]springer[dot]com | Anbieter: preigu.

Seller Inventory # 115522413

Bibliographic Details

• Title: Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach
• Publisher: Springer International Publishing
• Publication Date: 2018
• Language: English
• ISBN 10: 3030093239
• ISBN 13: 9783030093235
• Binding: Taschenbuch
• Condition: Neu
• Dimensions: 235W x 155H x 11D millimeters 235 millimeters width by 155 millimeters height by 11 millimeters depth
• Weight: 295 grams
• Seller catalogs:
  • Bücher

About this title

Synopsis

This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design.  Based on the author’s extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips and intellectual property blocks from any vendor to build a more complex chip, more efficiently and cost effectively.  Various practical examples and industrial projects are presented throughout the book, including questions and term projects at the end of each chapter. This book is a great resource for practicing engineers and can be used at universities to teach a course at the senior undergraduate and graduate level.

About the Author

Farhang Yazdani is the Founder and CEO of BroadPak Corporation. BroadPak is internationally recognized as the “key provider of innovative total solution for 2.5D/3D products”. Through his 18 years with the industry, he has served in various technical, management, and advisory positions with leading semiconductor companies worldwide. He is widely regarded as an expert in 2.5D and 3D integration technologies. He is the recipient of 2013 NIPSIA award in recognition of his contribution to the advancement and innovations in packaging technologies. He has numerous publications and IPs in the area of 2.5D/3D Packaging and Assembly, serves on various technical committees and is a frequent reviewer for IEEE Journal of Advanced Packaging. He received his undergraduate and graduate degrees in Chemical Engineering and Mechanical Engineering from the University of Washington, Seattle.