Grain Structures & Effects of Stress on Grain Boundaries

Language: English

Published by LAP LAMBERT Academic Publishing Jul 2018, 2018

6139877873 / 9786139877874

  • Softcover
  • New
See all details

Seller: buchversandmimpf2000, Emtmannsberg, BAYE, Germanybuchversandmimpf2000

5-star seller

AbeBooks seller since January 23, 2017

Softcover

Condition: New

US$ 46.03

US$ 67.20 shipping 
Ships from Germany to U.S.A.

Quantity: 1 available

Add to basket
Free 30-day returns

Item description from seller

This item is printed on demand - Print on Demand Titel. Neuware -Developing higher density microelectronics devices is the impact of the stresses induced by Coefficient of Thermal Expansion (CTE) mismatches of the materials used. Here I discuss the use of 3D grain continuum modeling to study grain boundary migration driven by differences in strain energy density. Comsol Multiphysics 4.3a (CM) is being used to compute stresses and strain energy densities in polycrystalline structures caused by temperature changes. We treat each grain as a single crystal, with the anisotropic elastic properties of single crystal Cu appropriately rotated to match grain orientation in space.VDM Verlag, Dudweiler Landstraße 99, 66123 Saarbrücken 68 pp. Englisch.

Seller Inventory # 9786139877874

Title
Grain Structures & Effects of Stress on Grain Boundaries
Author
Manvinder Sharma
Publisher
LAP LAMBERT Academic Publishing Jul 2018
Publication year
2018
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
6139877873
ISBN 13
9786139877874
Item weight
119 grams
Dimensions
220x150x5 mm

buchversandmimpf2000

Emtmannsberg, BAYE, Germany

5-star seller

AbeBooks seller since January 23, 2017

Shipping rates from Germany to U.S.A.

Item60 to 60 business days60 to 60 business days
First itemUS$ 67.20US$ 84.00
Delivery times are set by sellers and vary by carrier and location. Orders passing through Customs may face delays and buyers are responsible for any associated duties or fees. Sellers may contact you regarding additional charges to cover any increased costs to ship your items.

Payment methods

  • Visa
  • Mastercard
  • American Express
  • Apple Pay
  • Google Pay
  • Check
  • Paypal

Store description

Impressum Thorsten Retsch Buchversand Mimpf2000 Oberölschnitz 16 95517 Emtmannsberg Deutschland Telefon: 09209-2023188 Email: mimpf2000@online.de USt-ID-Nr.: DE 235096871 Wir führen gebrauchte Bücher aus allen Sparten der Literatur

Specialty

Modernes Antiquariat - Bücher von 1960 bis heute

Seller's business information

buchversandmimpf2000

Germany