HIGH PERFORMANCE DESIGN AUTOMATION FOR MULTI-CHIP MODULES AND PACKAGES (Hardcover)

Paul D. Franzon

ISBN 10: 9810223072 / ISBN 13: 9789810223076

Published by World Scientific Publishing Co Pte Ltd, Singapore, 1996

About this Item

Hardcover. Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers in this issue cover: design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems arisen in MCM and other packages. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers cover areas such as design optimization and physical partitioning, and global routeing/multi-layer assignment. Shipping may be from multiple locations in the US or from the UK, depending on stock availability.

Seller Inventory # 9789810223076

Bibliographic Details

• Title: HIGH PERFORMANCE DESIGN AUTOMATION FOR MULTI-CHIP MODULES AND PACKAGES (Hardcover)
• Publisher: World Scientific Publishing Co Pte Ltd, Singapore
• Publication Date: 1996
• Language: English
• ISBN 10: 9810223072
• ISBN 13: 9789810223076
• Binding: Hardcover
• Condition: new

About this title

Synopsis

Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.