Hardware/Firmware Interface Design
Language: English
Published by Elsevier, 2009
- Hardcover
- New

Seller: Biblios, frankfurt am main, hessen, GermanyBiblios
AbeBooks seller since September 10, 2024
Condition: New
US$ 105.95
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Add to basketItem description from seller
Seller Inventory # 181323229
- Title
- Hardware/Firmware Interface Design
- Author
- Stringham Gary
- Publisher
- Elsevier
- Publication year
- 2009
- Condition
- New
- Binding
- Hardcover
- Language
- English
- ISBN 10
- 1856176053
- ISBN 13
- 9781856176057
- Reduce product development delays with the best practices in this book
- Concepts apply to ASICs, ASSPs, SoCs, and FPGAs
- Real-world examples and case studies highlight the good and bad of design processes
"Synopsis" may belong to another edition of this title.
About the Author
Gary Stringham is the founder and president of Gary Stringham & Associates, LLC. He has 30+ years of experience in the embedded systems industry, assisting clients in their product development and engineering training. He has extensive expertise in diagnosing and resolving a broad range of engineering problems, including: helping litigation clients understand technical aspects of case; working on the design, implementation, and testing of solutions involving software, hardware, and firmware.
Gary previously worked for Hewlett-Packard Company, where he developed and maintained several device drivers controlling a variety of blocks on various ASICs and SoCs for HP LaserJet printers. This involved diagnosing chip problems when they occurred and designing and developing firmware workarounds.
Gary helped develop various tools used for the development, testing, and manufacturing of HP-UX workstation and LaserJet printer products. For a printer emulator tool, he developed the board design, the FPGA code, the firmware running on the tool, and the software running on the host computer. In one instance, the emulator reduced a 40-hour manual test to a 35-minute automated test. For a manufacturing test tool, he architected the tool, led a team of 10 engineers to develop it, and deployed it at five manufacturing sites world-wide.
Gary is a Senior Member of IEEE. He holds a BSEE from Brigham Young University and an MSEE from Utah State University."About the title" may belong to another edition of this title.
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