Heat Transfer Augmentation in a Semiconductor Device

G. S. Bhatt

ISBN 10: 3659472808 / ISBN 13: 9783659472800

Published by LAP LAMBERT Academic Publishing, 2013

About this Item

nach der Bestellung gedruckt Neuware - Printed after ordering - With circuit densities continuing to increase at the rate of 30% per year, the problem associated with the thermal control of electronic devices will continue to multiply. Thermal control of electronic components has one principal objective to maintain relatively constant component temperature equal to or below the specified temperature. For the heat fluxes 1.0 to 10.0 W/cm2, forced air convection may be employed. Investigations have demonstrated that a component operating 10 C above the specified temperature can reduce the reliability of some systems by as much as 50%. New techniques that are capable of eliminating hot spots in the printed circuit boards with semiconductor chips must be developed. From reliability point of view, the peak temperatures are limited to lower values than in the past. These concerns have generated motivation for research study of forced convection cooling in electronic equipments with printed circuit boards. The flow in these channels is usually low due to small dimensions and so, a number of innovative techniques are imperative to achieve higher heat transfer.

Seller Inventory # 9783659472800

Bibliographic Details

• Title: Heat Transfer Augmentation in a Semiconductor Device
• Publisher: LAP LAMBERT Academic Publishing
• Publication Date: 2013
• Language: English
• ISBN 10: 3659472808
• ISBN 13: 9783659472800
• Binding: Taschenbuch
• Condition: Neu
• Dimensions: 220W x 150H x 12D millimeters 220 millimeters width by 150 millimeters height by 12 millimeters depth
• Weight: 298 grams

About this title

Synopsis

With circuit densities continuing to increase at the rate of 30% per year, the problem associated with the thermal control of electronic devices will continue to multiply. Thermal control of electronic components has one principal objective to maintain relatively constant component temperature equal to or below the specified temperature. For the heat fluxes 1.0 to 10.0 W/cm2, forced air convection may be employed. Investigations have demonstrated that a component operating 10○C above the specified temperature can reduce the reliability of some systems by as much as 50%. New techniques that are capable of eliminating hot spots in the printed circuit boards with semiconductor chips must be developed. From reliability point of view, the peak temperatures are limited to lower values than in the past. These concerns have generated motivation for research study of forced convection cooling in electronic equipments with printed circuit boards. The flow in these channels is usually low due to small dimensions and so, a number of innovative techniques are imperative to achieve higher heat transfer.

About the Author

Dr. Bhatt has served some reputed engineering colleges in Bangalore, India, as a faculty over fifteen years. Dr. Bhatt has conducted a few training programs for the engineering faculty. He has published many research papers in reputed journals, and he has been active in the research areas like electronic cooling, heat exchangers, bio-fuels etc..