New research and applications in electro-magnetic compatibility and noise reduction
The new edition of Electromagnetic Compatibility Engineering reflects the most recent developments in the field of electro-magnetic compatibility (EMC) and noise reduction, covering practical applications in the design of analog and digital circuits in computer, home entertainment, medical, telecom, industrial process control, and automotive equipment, as well as military and aerospace systems. The book discusses full-wave simulation techniques, how they work, and their strengths and weaknesses, and examines high-speed differential signals and the common-mode noise creation from these signals.
Updating core information on cabling, grounding, filtering, shielding, digital circuit grounding and layout, and ESD, this new edition also discusses increased data rates and information on basic signal integrity.
Discover information on:
- What simulation tools can and cannot do, the finite element technique, and the partial element equivalent circuit technique
- Common mode noise from high speed differential signals, covering common node noise creation from in-pair skew, amplitude mismatch, and rise-fall time mismatch
- How to mitigate common mode noise through electromagnetic band gap (EBH) structures and transmission line grading
- The importance of slew rate, and difference between slew rate and signal rise time for real and test signals
- How to calculate the inductance associated with connecting decoupling capacitors
This new edition of Electromagnetic Compatibility Engineering is an excellent learning resource for graduate students in electromagnetic programs of study, and holds value for professionals in related fields seeking the latest cutting-edge research.
BRUCE R. ARCHAMBEAULT is an IEEE Fellow, an IBM Distinguished Engineer Emeritus, and an Adjunct Professor at Missouri University of Science and Technology. He received his PhD from the University of New Hampshire in 1997. His doctoral research focused on computational electromagnetics applied to real-world EMC problems.
JAMES L. DREWNIAK received BS (highest honors), MS, and PhD degrees from the University of Illinois at Urbana-Champaign. He is a Curator's Professor Emeritus at the Missouri University of Science and Technology. He continues to work as a faculty member in the Missouri S&T EMC Laboratory, as well as consult and provide short courses in industry. He is an IEEE Fellow.
JOSEPH (JAY) DIEPENBROCK holds electrical engineering degrees from Brown University and Syracuse University and has expertise in IC, analog/RF, backplane, cable, and connector design and testing. A contributor to EIA-364, PCI Express, InfiniBand, and IEEE 370, he is currently an RF and signal integrity consultant with Northrop Grumman Corp. and SIRF Consultants, LLC.
