High Frequency Interconnect Characterization and Modeling : For VLSI On-Chip Interconnects and RF Package Wire Bonds

Language: English

Published by VDM Verlag Dr. Müller, 2009

3639130952 / 9783639130959

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Seller: AHA-BUCH GmbH, Einbeck, GermanyAHA-BUCH GmbH

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nach der Bestellung gedruckt Neuware - Printed after ordering - Continuous scaling of transistors combined withincreased chip area results in the ratio of globalwire delay to gate delay increasing at a super-linearrate. Simple RC models have become inadequate forsimulation of VLSI circuits. In addition, parasiticinductance and capacitance of IC packages imposelimits on the circuit performance at RF frequencies.This book presents modeling of on-chip inductance forchips with ground grids that emulate those used inreal circuits. S-parameter characterization of testchips up to 10 GHz shows good agreement withsimulation and analytical calculations. On-chip 3-Dcapacitance modeling capabilities for arbitrarilyshaped objects are also presented. In addition, anapproach to fast 3-D modeling of the geometry forbonding wires in RF circuits and packages isdemonstrated. The geometry and an equivalent circuitare presented to model the frequency response ofbonding wires. Excellent agreement between modeledresults and measured data is achieved for frequenciesup to 10 GHz. The book should be useful to thesemiconductor professionals in academia and industry,who are interested in the on-chip and packageinterconnects researches.…

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Title
High Frequency Interconnect Characterization and Modeling : For VLSI On-Chip Interconnects and RF Package Wire Bonds
Author
Xiaoning Qi
Publisher
VDM Verlag Dr. Müller
Publication year
2009
Condition
Neu
Binding
Taschenbuch
Language
English
ISBN 10
3639130952
ISBN 13
9783639130959
Item weight
193 grams
Dimensions
220x150x8 mm

AHA-BUCH GmbH

Einbeck, Germany

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AbeBooks seller since August 14, 2006

Shipping rates from Germany to U.S.A.

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