IC Designs for Wireless Networks
Language: English
Published by Moonkloud, 2026
- Softcover
- New

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- Title
- IC Designs for Wireless Networks
- Author
- Goyal, Ravender
- Publisher
- Moonkloud
- Publication year
- 2026
- Condition
- New
- Binding
- PAP
- Language
- English
- ISBN 13
- 9798234078582
- Item weight
- 685 grams
Wireless communication has entered a new era as 5G networks scale globally and industry moves to 6G, demand for high-performance, highly integrated RF circuits has never been greater, nor the need for a definitive reference to address the full spectrum of design challenges.
IC Designs for Wireless Networks is written for practicing RF and Analog IC engineers, graduate students, and researchers seeking both a solid theoretical foundation and practical circuit design guidance. The book covers GaAs technology, pHEMT modeling, RF building blocks, wideband amplifiers, mixers, oscillators, and A/D and D/A converters, all presented within the context of the system requirements and wireless standards.
What sets this book apart is its collaborative approach. RF design is both broad and highly specialized, making it difficult for any single author to provide authoritative coverage across the field. This volume brings together internationally recognized experts, each contributing first hand expertise in their area of specialization. The result is a level of technical depth and breadth that no single-author text can achieve.
Every chapter combines analytical foundations with design examples drawn from circuits proven in volume production. Readers gain not only a solid understanding of the underlying principles but also the real-world engineering perspective to translate that knowledge into successful IC implementations.
Ravender Goyal brings his experience that bridges the gap between foundational theory and practical application. This is not simply a collection of knowledge, but a meticulously structured journey through the principles and techniques that define HF analog design - one that serves well as an educational tool for students and as a professional reference for engineers seeking to deepen their expertise. The book builds from fundamental concepts toward progressively more advanced material, opening with an authoritative overview of global cellular standardization - spanning from 3G through the emerging 6G framework, the 3GPP specification process, technical performance requirements, spectrum allocation, and the radio characteristics of base stations and mobile devices - providing the systems-level context within which the circuits described in subsequent chapters must operate. Each chapter is carefully crafted to deliver clear explanations supported by mathematical rigor and real-world examples that connect theory to practice. In conclusion, this is a seminal contribution to the field of high-frequency analog design - a testament to the depth of expertise and the collaborative effort that its contributors have brought to bear, this volume will take its place as a standard reference in the libraries of engineers, researchers, and students for years to come. CONTRIBUTORS:DR. PHILLIP ALLEN, Georgia Institute of Technology, USA
Dr. C. M. BREEVOORT, Lockheed, USA.
DR. TZU-HUNG CHEN, Ultraband Technology, Taiwan
DR. DONALD ESTREICH, Sonoma State University, USA
RAVENDER GOYAL, MOONKLOUD, USA
DR. LARRY LARSON, Brown University, USA
AJAY KUMAR MITTAL, India
DR. PASCAL PHILIPPE, NXP Semi, Netherlands
DR. MEHDI F. SOLTAN, Sana Semi, Hong Kong This book is dedicated to AINAK (myainak.org), a Goyal Family Foundation non-profit committed to bringing free vision care to underserved communities all across the world. All proceeds from the sale of this book will support this mission."Synopsis" may belong to another edition of this title.
About the Author
Larry E. Larson is Professor of Engineering at Brown University and serves as Sorensen Family Dean-Emeritus of Engineering. He is widely recognized for his contributions to microwave and millimeter-wave integrated circuits, RF and mixed-signal IC design, wireless communication systems, and semiconductor technologies for high-frequency applications. Over the course of his distinguished academic and research career, he has made significant contributions to the advancement of wireless and high-speed electronic systems through pioneering work in integrated circuit design, device technologies, and system-level innovation. Dr. Larson is a Fellow of the IEEE and a member of the U.S. National Academy of Engineering.
Dr. Tzu-Hung Chen is a semiconductor and RF technology expert currently associated with Ultraband Technology Inc., where he contributes to advanced wireless communication and RF device development. He holds a B.Ed. in Physics from National Changhua University of Education, an M.S. in Physics from National Taiwan Normal University, and a Ph.D. in Electrical Engineering from the University of Minnesota. His professional work spans microwave and RF engineering, including high-frequency device and system design for modern wireless applications. He has built a career focused on advancing semiconductor-based communication technologies, particularly in areas relevant to 5G and next-generation RF systems.
"About the title" may belong to another edition of this title.
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